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Extreme UV lithography is a next-generation lithography technology, which uses the smallest wavelength to create circuits with small features and obtain an output with better resolution. Lithography is used to print complex patterns that define integrated circuits onto semiconductor wafers. EUV lithography (EUVL) is one of the leading next generation lithography (NGL) technologies. Discharge-produced plasma (DPP) and laser-produced plasma (LPP) are the prominent technologies used to produce high power EUV radiation.

 

EUV lithography market (EUVL) is expected to increase from US$ 1.51 billion in 2020, and is expected to reach US$ 9.82 Bn by 2027, growing at a CAGR of 26.7% during the forecast period.

 

The Global EUV Lithography Industry Segmentation:

By Equipment

Light Source

Laser Produced Plasmas (LPP)

Vacuum Sparks

Gas Discharges

Mirrors

Mask

Others

 

By End-user

IDM

Foundry

 

By Region

North America

Europe

Asia Pacific

Latin America

Middle East & Africa

 

Asia Pacific to Account for Significant Market Share in EUV Market

APAC is witnessing growth in the EUV Market owing to the growing demand from Fab-less players at leading foundries and the rising number of wafer processing capability in the region. Additionally, there is the presence of a large number of foundries and leading IDMs such as Samsung (South Korea), SK Hynix (South Korea), and Toshiba (Japan) in the region. TSMC (Taiwan), the world’s leading foundry, is investing in the expansion of its wafer-processing capability and is planning to invest in the EUV lithography technology as well. The emerging market for performance and storage memory in consumer applications will significantly boost the adoption of EUV lithography in APAC.

 

Company Profiles and Competitive Intelligence

 

Key players in the EUV lithography market include ASML Holding (Netherlands), Nikon (Japan), Canon (Japan), Carl Zeiss (Germany), Toppan Printing (Japan), NTT Advanced Technology (Japan), Intel (US), Samsung (South Korea), SK Hynix (South Korea), Toshiba (Japan), TSMC (Taiwan), and GLOBALFOUNDRIES (US).

 

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